Table of Contents

www.kxcad.net Home > CAE Index > ANSYS Index > Release 11.0 Documentation for ANSYS

1. Coupled-Field Analyses

1.1. Types of Coupled-Field Analysis

1.1.1. Direct Method

1.1.2. Load Transfer Methods

1.1.3. When to Use Direct vs. Load Transfer

1.1.4. Additional Analysis Methods

1.2. System of Units

1.3. About GUI Paths and Command Syntax

2. Direct Coupled-Field Analysis

2.1. Lumped Electric Elements

2.2. Thermal-Electric Analysis

2.2.1. Elements Used in a Thermal-Electric Analysis

2.2.2. Performing a Thermal-Electric Analysis

2.3. Piezoelectric Analysis

2.3.1. Points to Remember

2.3.2. Material Properties

2.4. Electroelastic Analysis

2.4.1. Elements Used in an Electroelastic Analysis

2.4.2. Performing an Electroelastic Analysis

2.5. Piezoresistive Analysis

2.5.1. Points to Remember

2.5.2. Material Properties

2.6. Structural-Thermal Analysis

2.6.1. Elements Used in a Structural-Thermal Analysis

2.6.2. Performing a Structural-Thermal Analysis

2.7. Structural-Thermal-Electric Analyses

2.7.1. Structural-Thermoelectric Analysis

2.7.2. Thermal-Piezoelectric Analysis

2.8. Magneto-Structural Analysis

2.8.1. Points to Remember

2.9. Electromechanical Analysis

2.9.1. The 1-D Transducer Element

2.9.2. The 2-D Transducer Element

2.10. Sample Thermoelectric Cooler Analysis (Batch or Command Method)

2.10.1. Problem Description

2.10.2. Expected Results

2.10.3. Command Listing

2.11. Sample Thermoelectric Generator Analysis (Batch or Command Method)

2.11.1. Problem Description

2.11.2. Expected Results

2.11.3. Command Listing

2.12. Sample Structural-Thermal Harmonic Analysis (Batch or Command Method)

2.12.1. Problem Description

2.12.2. Expected Results

2.12.3. Command Listing

2.13. Sample Electro-Thermal Microactuator Analysis (Batch or Command Method)

2.13.1. Problem Description

2.13.2. Results

2.13.3. Command Listing

2.14. Sample Piezoelectric Analysis (Batch or Command Method)

2.14.1. Problem Description

2.14.2. Problem Specifications

2.14.3. Results

2.14.4. Command Listing

2.15. Sample Piezoelectric Analysis with Coriolis Effect (Batch or Command Method)

2.15.1. Problem Description

2.15.2. Problem Specifications

2.15.3. Results

2.15.4. Command Listing

2.16. Sample Electroelastic Analysis of a Dielectric Elastomer (Batch or Command Method)

2.16.1. Problem Description

2.16.2. Problem Specifications

2.16.3. Results

2.16.4. Command Listing

2.17. Sample Electroelastic Analysis of a MEMS Switch (Batch or Command Method)

2.17.1. Problem Description

2.17.2. Problem Specifications

2.17.3. Results

2.17.4. Command Listing

2.18. Sample Piezoresistive Analysis (Batch or Command Method)

2.18.1. Problem Description

2.18.2. Problem Specification

2.18.3. Results

2.18.4. Command Listing

2.19. Sample Electromechanical Analysis (Batch or Command Method)

2.19.1. Problem Description

2.19.2. Expected Results

2.19.3. Building and Solving the Model

2.20. Sample Electromechanical Transient Analysis (Batch or Command Method)

2.20.1. Results

2.20.2. Command Listing

2.21. Sample Electromechanical Hysteresis Analysis (Batch or Command Method)

2.21.1. Problem Specifications

2.21.2. Results

2.21.3. Command Listing

2.22. Sample Electromechanical Comb Finger Analysis (Batch or Command Method)

2.22.1. Problem Specifications

2.22.2. Results

2.22.3. Command Listing

2.23. Sample Force Calculation of Two Opposite Electrodes (Batch or Command Method)

2.23.1. Problem Specifications

2.23.2. Results

2.23.3. Command Listing

2.24. Where to Find Other Examples

3. The ANSYS Multi-field (TM) Solver - MFS Single-Code Coupling

3.1. The ANSYS Multi-field solver and Solution Algorithm

3.1.1. Load Transfer

3.1.2. Mapping

3.1.3. Coupled Field Loads

3.1.4. Elements Supported

3.1.5. Solution Algorithm

3.2. ANSYS Multi-field solver Solution Procedure

3.2.1. Set up Field Models

3.2.2. Flag Field Interface Conditions

3.2.3. Set up Field Solutions

3.2.4. Obtain the solution

3.2.5. Postprocess the Results

3.3. Sample Thermal-Stress Analysis of a Thick-walled Cylinder (Batch or Command Method)

3.3.1. Problem Description

3.3.2. Results

3.3.3. Command Listing

3.4. Sample Electrostatic Actuated Beam Analysis (Batch or Command Method)

3.4.1. Problem Description

3.4.2. Results

3.4.3. Command Listing

3.5. Sample Induction-Heating Analysis of a Circular Billet

3.5.1. Problem Description

3.5.2. Results

3.5.3. Command Listing

4. Multi-field Analysis Using Code Coupling

4.1. How MFX Works

4.1.1. Synchronization Points and Load Transfer

4.1.2. Load Interpolation

4.1.3. Elements and Load Types Supported

4.1.4. Solution Process

4.2. MFX Solution Procedure

4.2.1. Set Up ANSYS and CFX Models

4.2.2. Flag Field Interface Conditions

4.2.3. Set Up Master Input

4.2.4. Obtain the Solution

4.2.5. Multi-field Commands

4.2.6. Postprocess the Results

4.3. Starting and Stopping an MFX Analysis

4.3.1. Starting an MFX Analysis via the Launcher

4.3.2. Starting an MFX Analysis via the Command Line

4.3.3. Stopping an MFX Run Manually

4.4. Example Simulation of a Piezoelectric Actuated Micro-Pump

5. Load Transfer Coupled Physics Analysis

5.1. What Is a Physics Environment?

5.2. General Analysis Procedures

5.3. Transferring Loads Between Physics

5.3.1. Compatible Element Types

5.3.2. Types of Results Files You May Use

5.3.3. Transient Fluid-Structural Analyses

5.4. Performing a Load Transfer Coupled Physics Analysis with Multiple Physics Environments

5.4.1. Mesh Updating

5.4.2. Restarting an Analysis Using Multiple Physics Environments

5.5. Example Thermal-Stress Analysis Using Separate Databases

5.5.1. The Problem Described

5.6. Example Thermal-Stress Analysis Using Multiple Physics Environments

5.7. Example Fluid-Structural Analysis Using Physics Environments

5.7.1. The Problem Described

5.7.2. The Procedure

5.7.3. Results

5.8. Example Induction-heating Analysis Using Physics Environments

5.8.1. The Problem Described

5.8.2. The Procedure

6. Unidirectional Load Transfer

6.1. The Unidirectional Load Transfer Method: ANSYS to CFX

6.2. Sample Unidirectional Load Transfer Analysis: ANSYS to CFX

6.2.1. ANSYS Command Listings

6.2.2. CFX Procedure

6.3. The Unidirectional Load Transfer Method: CFX to ANSYS

7. Coupled Physics Circuit Simulation

7.1. Electromagnetic-Circuit Simulation

7.1.1. 2-D Circuit Coupled Stranded Coil

7.1.2. 2-D Circuit Coupled Massive Conductor

7.1.3. 3-D Circuit Coupled Stranded Coil

7.1.4. 3-D Circuit Coupled Massive Conductor

7.1.5. 3-D Circuit Coupled Solid Source Conductor

7.1.6. Taking Advantage of Symmetry

7.1.7. Series Connected Conductors

7.2. Electromechanical-Circuit Simulation

7.3. Piezoelectric-Circuit Simulation

7.4. Sample Electromechanical-Circuit Analysis

7.4.1. Problem Description

7.4.2. Results

7.4.3. Command Listing

7.5. Sample Piezoelectric-Circuit Analysis (Batch or Command Method)

7.5.1. Problem Description

7.5.2. Problem Specifications

7.5.3. Equivalent Electric Circuits (Reduced Order Model)

7.5.4. Results

7.5.5. Command Listing

8. Reduced Order Modeling

8.1. Model Preparation

8.1.1. Build the Solid Model

8.1.2. Mesh the Model

8.1.3. Create Structural Physics File

8.1.4. Create Electrostatic Physics File

8.1.5. Save Model Database

8.2. Generation Pass

8.2.1. Specify Generation Pass Jobname

8.2.2. Assign ROM Features

8.2.3. Assign Names for Conductor Pairs

8.2.4. Specify ROM Master Nodes

8.2.5. Run Static Analysis for Test Load and Extract Neutral Plane Displacements

8.2.6. Run Static Analysis for Element Loads and Extract Neutral Plane Displacements

8.2.7. Perform Modal Analysis and Extract Neutral Plane Eigenvectors

8.2.8. Select Modes for ROM

8.2.9. Modify Modes for ROM

8.2.10. List Mode Specifications

8.2.11. Save ROM Database

8.2.12. Run Sample Point Generation

8.2.13. Specify Polynomial Order

8.2.14. Define ROM Response Surface

8.2.15. Perform Fitting Procedure

8.2.16. Plot Response Surface

8.2.17. List Status of Response Surface

8.2.18. Export ROM Model to External System Simulator

8.3. Use Pass

8.3.1. Clear Database

8.3.2. Define a Jobname

8.3.3. Resume ROM Database

8.3.4. Define Element Type

8.3.5. Define Nodes

8.3.6. Activate ROM Database

8.3.7. Define Node Connectivity

8.3.8. Define Other Model Entities

8.3.9. Using Gap Elements with ROM144

8.3.10. Apply Loads

8.3.11. Specify Solution Options

8.3.12. Run ROM Use Pass

8.3.13. Review Results

8.4. Expansion Pass

8.4.1. Clear Database

8.4.2. Define a Jobname

8.4.3. Resume ROM

8.4.4. Resume Model Database

8.4.5. Activate ROM Database

8.4.6. Perform Expansion Pass

8.4.7. Review Results

8.5. Sample Miniature Clamped-Clamped Beam Analysis (Batch or Command Method)

8.5.1. Problem Description

8.5.2. Program Listings

8.6. Sample Micro Mirror Analysis (Batch or Command Method)

8.6.1. Problem Description

8.6.2. Program Listings